发明名称 MOLDING APPARATUS
摘要 PURPOSE:To avoid the yield of voids in a molded product with damages of molds being avoided, by inserting a part of a material, which is inserted in a main cavity, in a sub-cavity so that the molded product in the sub-cavity at least supports the inserting part. CONSTITUTION:A material to be packaged 10 is set on a bottom force 2 so that a pellet 18, inner leads 15 and bonding wires 19 are contained in a main cavity. Then, a top force 1 is coupled with the bottom force 2, and the main cavity 3 and a sub-cavity 6 are formed. An outer frame 12 and outer leads of a lead frame 11 are held between the top and lower forces 1 and 2. A resin 21 in a runner 4 is injected in the main cavity 3 through a gate 5. Air in the main cavity 3 is exhausted to the outside through a sub-gate 7, the sub-cavity 6 and an air vent 8. When the injection of the resin 21 comes to a final stage, the resin 21 is injected into the upper part of the sub-cavity 6 through the main cavity 3 and the sub-gate 7. The resin also fills the upper part of the sub-cavity 6 through a positioning hole 20.
申请公布号 JPS62193131(A) 申请公布日期 1987.08.25
申请号 JP19860032945 申请日期 1986.02.19
申请人 HITACHI LTD 发明人 SAKAMOTO TOMOO
分类号 B29C39/10;B29C39/26;B29L31/34;H01L21/56 主分类号 B29C39/10
代理机构 代理人
主权项
地址