发明名称 |
Copper adhesive composition |
摘要 |
Specific thermoplastic compositions which are formulated to be exceptionally useful for adhesion to copper-containing metals are prepared from either glycidyl acrylate grafts of polypropylene based formulations with a minor elastomeric component or low density polyethylene based formulations grafted with acrylic acid and/or glycidyl acrylate and containing a minor elastomeric component.
|
申请公布号 |
US4310636(A) |
申请公布日期 |
1982.01.12 |
申请号 |
US19780946894 |
申请日期 |
1978.09.28 |
申请人 |
EXXON RESEARCH & ENGINEERING CO. |
发明人 |
BARTZ, KENNETH W. |
分类号 |
B65D85/24;C09J123/02;C09J151/00;C09J151/06;F16B15/08;(IPC1-7):C08L51/04;C08L51/06 |
主分类号 |
B65D85/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|