发明名称 Copper adhesive composition
摘要 Specific thermoplastic compositions which are formulated to be exceptionally useful for adhesion to copper-containing metals are prepared from either glycidyl acrylate grafts of polypropylene based formulations with a minor elastomeric component or low density polyethylene based formulations grafted with acrylic acid and/or glycidyl acrylate and containing a minor elastomeric component.
申请公布号 US4310636(A) 申请公布日期 1982.01.12
申请号 US19780946894 申请日期 1978.09.28
申请人 EXXON RESEARCH & ENGINEERING CO. 发明人 BARTZ, KENNETH W.
分类号 B65D85/24;C09J123/02;C09J151/00;C09J151/06;F16B15/08;(IPC1-7):C08L51/04;C08L51/06 主分类号 B65D85/24
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