发明名称 METALLIC THIN STRIP FOR INSTALLING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
摘要 PURPOSE:To prevent the lowering of luminous output by putting a metallic layer into which copper is difficult to diffuse between a copper layer and a silver layer at a tip section of a lead wire for installing the semiconductor light-emitting element. CONSTITUTION:A Ni kayer 14 is put between the Cu layer 12 and the Ag layer 13 on a Fe raw marerial 11. According to this constitution, the amount of Cu ions precipitating on the surface can be decreased without thickening the thickness of the expensive Ag layer 13, and manufacturing cost is reduced while an adverse effect on the luminous output characteristic of a light-emitting diode pellet due to Cu ions can be prevented.
申请公布号 JPS574182(A) 申请公布日期 1982.01.09
申请号 JP19800078159 申请日期 1980.06.10
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 FUKUDA IKUO;USUI KIYOSHI;YAMAMOTO HIROSHI;SHINDOU MASAMICHI;FUJISAKI MASANOBU
分类号 H01L23/48;H01L33/60;H01L33/62 主分类号 H01L23/48
代理机构 代理人
主权项
地址