COOLING TUNNELS FOR SEMICONDUCTOR DEVICES

摘要

COOLING TUNNELS FOR SEMICONDUCTOR DEVICES A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned 80 that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. FI9-77-066