| 摘要 |
PURPOSE:To obtain the IC for watch at a low cost and to manufacture the IC in a thin type and to enhance reliability thereof by a method wherein a resin film is applied on an IC wafer formed with bumps, and after the resin film on the bumps and street lines are removed, the wafer is divided into chips and the IC is mounted. CONSTITUTION:The resin film 5 is applied on the whole surface of the IC wafer 1 being formed with the Au bumps 4 on Al pads 41 interposing barrier metal layers 43 between them to form protective layers. After the refin film 5 on the street lines 2 to divide the wafer 1 and the bumps 4 are removed, the chips 3 are made out by scribing. Then the chips 3 are jointed to flexible substrates by the bumps 4 and the IC is mounted. Accordingly because the area of the Au bumps 4 can be made as smaller than the pads 41, and resin sealing process can be simplified, the IC can be obtained at the low cost. Moreover the IC can be manufactured in the thin type without damaging reliability of the IC. |
