发明名称 MOLD FOR SANDWICH STRUCTURE BODY
摘要 PURPOSE:To produce a skin layer having a desired thickness at a desired part of a molded article and thereby enhance the strength of the molded body by a method wherein a mold body forming a mold cavity is provided with a cooling hole for passing a coolant therethrough at a part of the mold body corresponding to the part of the article to be enhanced in strength. CONSTITUTION:The cooling hole 7 is provided at a corner part 5b of an upper mold 5A having holes 8 for temperature regulation in the proximity of the mold cavity 4. Two kinds of stock solutions are poured into the cavity 4 formed by the upper mold 5A and a lower mold 6. Before the stock solutions are solidified through reacting with each other to form the sandwich structure body 1A, the coolant cooled to a temperature of -5-+10 deg.C is circulated through the cooling hole 7 to cool the stock solution in the proximity to the hole 7, thereby producing the skin layer 2b having a high density and the desired thickness.
申请公布号 JPS56164830(A) 申请公布日期 1981.12.18
申请号 JP19800068889 申请日期 1980.05.26
申请人 HITACHI LTD 发明人 GOTOU MASAO;NAKAMURA SHIYOUZOU;KOUYA KENICHI;YOKONO ATARU;AOKI MASAYOSHI;SHIBATA KATSUO;NAKA REIJI
分类号 B32B5/18;B29B7/00;B29B13/00;B29C33/00;B29C33/02;B29C33/04;B29C39/00;B29C39/12;B29C39/26;B29C39/38;B29C44/04;B29C45/73 主分类号 B32B5/18
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