COPPER-CLAD LAMINATE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a copper-clad laminate which has a smaller linear expansion coefficient in the surface direction than a conventional one. SOLUTION: In a copper-clad laminate prepared by a process in which copper foil is arranged at least on one surface of a laminate of one or more glass base materials impregnated with varnish containing a thermosetting resin, and the laminate is cured by heating, silicone rubber particles 5μm or less in average particle size are dispersed in the cured resin of the copper-clad laminate, and the percentage the silicone rubber particles to the total of the resin and the particles is 3% or more. The copper-clad laminate is manufactured by using the varnish containing the thermosetting resin in which the silicone rubber particles are dispersed.