| 摘要 |
<p>PURPOSE:To remove danger where that a dust particle fallen from a wafer adheres to another wafer or that the dust particle mixed with the air adheres to the wafer by a method wherein, the wafer is housed in such a way that it is inserted into a cartridge perpendicularly, i.e. in a vertical direction, by using an air suction system. CONSTITUTION:When a wafer 2 is to be loaded into a wafer processing device, the wafer 2 housed in a cartridge 20 in a vertical direction is sucked by a suction arm 18 in a position indicated by a two-point chain line; the wafer faces the wafer processing device by using a third drive mechanism 18. A rotary shaft 13 is turned by using a second drive mechanism, and a face of the wafer 2 is situated horizontally; in succession, a linear shift mechanism 8 is shifted by using a first drive mechanism, and the wafer 2 is introduced into the processing device and is loaded. When the wafer is to be unloaded, a reverse operation is executed. The clean air which has fallen inside a clean room and has entered the inside of a dust cover through an opening 23a discharges a dust particle which is produced at individual drive mechanisms through an air exhaust port 24; the air prevents the dust particle from flowing toward a direction of the wafer 2.</p> |
