Method and apparatus for mounting an electronic component on a substrate.

摘要

The mounting apparatus comprises: a cutting station (1) for carrying out the separation of the component (22) mounted previously in an opening of a flexible support in which conductive elements, the internal extremities of which are soldered to the connecting areas of the component, project radially; an alignment station (2) for aligning the component and the substrate, transfer means (6,7,8) for picking up a component at the cutting station and bringing it to the alignment station, and a solder tool (11) for carrying out the electrical connection of the component positioned on its substrate (4). <IMAGE>