| 摘要 |
A polyamide acid polymer is partially imidized to an imidization level of greater than 6% up to 70%. A coating medium comprises the partially imidized polymer in a phenolic based aromatic solvent. A bondable coating on a substrate such as magnet wire comprises a coating of the coating medium with the polymer partially cured and imidized to a level of not more than 90%. The coating of the partially imidized polyamide acid polymer can be applied over a base coat enamel, such as a polyesterimide, and partially cured to a bondable "B- stage" or fully cured to form a polyimide coating. |
