HEAT RELEASE ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To obtain a heat release adhesive sheet capable of preventing reduction in yield by electrostatic discharge damage to an electronic part while securing adhesive functions before heating and peelability after heating of the heat release adhesive sheet even in the case of temporarily fixing the electronic part such as a magnetic head weak in static electricity. SOLUTION: This heat release adhesive sheet is characterized in that the heat release adhesive sheet is provided with a thermally expandable adhesive layer containing a thermally expandable spherule at least on one side of a substrate and surface resistivity of the thermally expandable adhesive layer is <=1012Ω/square. The heat release adhesive sheet may have <=2μm average roughness of central line of the thermally expandable adhesive layer before heating and <=5μm maximum roughness. The heat release adhesive sheet may have a rubber-like organic elastic layer between the substrate and the thermally expandable adhesive layer.