Chemical copper-plating bath.

摘要

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula:
<Chemistry id="chema01" num="0001"><Image id="ia01" he="18" wi="98" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /></Chemistry>Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-solub!e cyanides.