| 摘要 |
PURPOSE:To obtain a more compact and lightweight vapor cooling type semiconductor device by disposing through-bushings for electrical connection separately on the cooled-body sealing container and the condenser side. CONSTITUTION:Main and auxiliary through-bushings 5 and 6 are disposed separately on the sealing container 1 side and the condenser 2 side. The auxiliary bushings 6 are divided between a side plate 1A of the sealing container and a header 2B of the condenser. The bushing provided to the header 2B and a semiconductor element 4A are connected by means of a conductor 7 inserted through a heat duct 3A. By said constitution, if the number of the through-bushing increases, it is unnecessary to increases the outer diameter of the sealing container 1. Therefore, the required amount of cooling medium 8 decreases, which is economical. In addition, the weight and the outer diameter also decreases, so that the price becomes lower. |
