| 摘要 |
PURPOSE:To improve the humidity resistance of a semiconductor device by forming an annular groove in the heat sink surface, between the resin end surface and the semiconductor element-mounting position, so as to surround the element. CONSTITUTION:An annular groove 16 is formed in the surface of a metal plate 12, surrounding a semiconductor element 13. The electrodes of the element 13 are connected 15 with external leads 14, and with the back surface of the metal plate 12 exposed, this is sealed with resin 11. The groove 16 permits the increase of the bonding area between the metal plate 12 and the resin 11, so that adhesion improves and the penetrating path of moisture elongates as well. By said constitution, the humidity resistance can be improved without increasing the external shape. The deeper and the larger the groove is in number, the more effective it becomes. |
