发明名称 HIGH PRESSURE PLASMA DEPOSITION OF SILICON
摘要 <p>Polycrystalline silicon (84) is deposited on the interior surface of a shaped container (40). The silicon is deposited by reacting hydrogen (31) and a silicon bearing gas (30) in the presence of a high pressure plasma (22). The silicon body is separated from the shaped container by utilizing thermal expansion shear stress. </p>
申请公布号 WO1981003133(A1) 申请公布日期 1981.11.12
申请号 US1981000449 申请日期 1981.04.06
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