摘要 |
<p>The lead-in wires of a plurality of flash lamps in a photoflash array are embedded in a circuit board and are in contact with circuit runs carried on one side of the board. For at least one of the lamps, one lead-in wire contacts a common ground circuit run on the one side of the board and has its end extending from the other side of the board to make electrical contact against a sheet-like shield member. In a preferred method of assembly, the lead-in wires of each lamp are driven through the circuit board by ultrasonic drivers offset from each other, so that one lead-in wire is driven into the board closer to its end the other lead-in wire.</p> |