| 摘要 |
<p>Disclosed is a device for elevating up and down a cleaning brush of a chemical mechanical wafer polishing apparatus, which elevates up and down the cleaning brush for cleaning alien substances on the wafer, which includes a fame; a reference brush rotatably supported by the frame; an elevation block installed at the frame in such a manner that the elevation block can be elevated up and down; an elevating brush rotatably installed at the elevation block, the elevating brush being elevated along with the elevation block while approaching or being spaced from the reference brush; and a linear motor for elevating the elevation block. It is possible to reduce a unit cost of product, production cost, and production time. Furthermore, there is an advantage in size-reduction and weight-reduction, and elevation driving can be accurately controlled.</p> |
