| 摘要 |
<p>The circuit board (11) has a chip (17) attached to its surface via an adhesive and held in position by a projection (15) acting as a stop edge on one or both sides of the facing circuit connection points for the chip (17). The projections (15) are formed on the surface of the circuit board (11) after deposition of a protective anti-solder material (14) over the surface of the circuit board (11) by a printing process. The projections (15) may be formed by an ink deposited on the surface of the circuit board (11) after a conventional silk screen printing process for providing the circuit conductor paths. Pref. two projections (15) between 35 and 50 mm in height are positioned facing one another symmetrical to the two connection points for the chip (17), with the peripheral edge of the latter contacting the circuit board (11) at a point halfway between them and resting on an adhesive blob (16).</p> |
