发明名称 THERMAL PROCESSING OF SEMICONDUCTOR
摘要 PURPOSE:To carry out an effective instantaneous annealing by causing the surface of a semiconductor to contact oxygen and hydrogen gas flame. CONSTITUTION:A polysilicon film 2 is formed on the main surface of a silicon substrate. If an oxygen and hydrogen flame 4 coming out of the nozzle of an upper burner 3 is scanned held toward the said polysilicon film 2 for thermal processing, a monocrystal can be formed on the surface of the polysilicon 2. In this manner, it is possible to comparatively easily and selectively apply a required amount of annealing process to a semiconductor material through the proper control of gas component composition, flow and scanning.
申请公布号 JPS56137643(A) 申请公布日期 1981.10.27
申请号 JP19800040507 申请日期 1980.03.31
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 IWAMATSU SEIICHI
分类号 H01L21/324;(IPC1-7):01L21/324 主分类号 H01L21/324
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