发明名称 |
Hybrid integrated circuit and a method for producing the same |
摘要 |
A hybrid integrated circuit for high output power having a conductive pattern on a ceramic substrate, a lead frame connected to said pattern, and electronic components mounted on said pattern wired with one another, has been found. When said conductive pattern has an inductor in a spiral shape, the same spiral pattern is conformed on the lead frame, and those two spiral patterns are overlapped. Thus, the resistance of the inductor is reduced since the conductive pattern and the lead frame pattern are connected parallel to each other. Then, a large current can be loaded to said inductance with only a small loss. As the material of the lead frame is cheap, the resultant hybrid integrated circuit can be manufactured at a lower cost. |
申请公布号 |
US4297647(A) |
申请公布日期 |
1981.10.27 |
申请号 |
US19790048849 |
申请日期 |
1979.06.15 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
AKIYAMA, MASAHIRO;KAMINISHI, KATUZO;KAWAKAMI, YASUSHI |
分类号 |
H01P3/08;H01L23/498;H01L25/16;H03F3/195;H03F3/20;H03F3/213;H05K1/03;H05K1/16;(IPC1-7):H03F3/14;H05K5/02 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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