发明名称 METHOD OF FORMING WIRING
摘要 PURPOSE:To easily and in good revivability obtain a wiring-pattern having a moderate inclination on a side surface of the end edge thereof by a method wherein ions are injected on an Al layer surface. CONSTITUTION:The Al layer 13 is formed on an insulating layer 2 on an Si substrate and injected with Ar ions. A resist mask 10 having the wiring pattern is formed to be etched and to form a wiring 14. At this time, an etching speed is high on the surface side due to the damage give by the ion-injection, so that the side etching is remarkably developed to enable the inclined plane 14a to be obtained on the edge side face. The resist mask 10 is removed to finish. A tilt angle can be formed arbitrarily accurately and in good revivability by selecting an ion-injection energy and a dosage.
申请公布号 JPS56134746(A) 申请公布日期 1981.10.21
申请号 JP19800038342 申请日期 1980.03.26
申请人 SONY CORP 发明人 OKAYAMA MASAKI;SOUMA TOKUROU;KUSUMOTO NORIHIRO
分类号 H01L21/3205;H01L21/306;H01L21/3213 主分类号 H01L21/3205
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