发明名称 FUSE PACKAGE AND LIGHT EMITTING DEVICE MODULE USING THE SAME
摘要 The present invention provides a fuse package and a light emitting device module using the same. The fuse package includes a first lead frame and a second lead frame which are separated from each other; a package body which molds at least part of the first and second lead frames; a wire fuse which is mounted on the package body and electrically connects the first and second lead frames; and a sealing part which seals the wire fuse. So, damage to a light emitting device module can be prevented.
申请公布号 KR20160083408(A) 申请公布日期 2016.07.12
申请号 KR20140194690 申请日期 2014.12.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SEUNG HWAN
分类号 H01L33/00;H01L33/48 主分类号 H01L33/00
代理机构 代理人
主权项
地址