摘要 |
Power semiconductor modules having vertically routed terminal lugs require soldering jigs which position and align the terminal lugs during soldering. …<??>The invention proposes using the plastic housing (10, 45) itself as soldering jig to avoid expensive soldering jigs. For this purpose, guide channels (11) for the terminal components (12, 41) or further mounting pieces (43, 44) or recesses (47.1, 47.2) are provided inside the housing (10, 45). It is also proposed to manufacture the housing (10, 45) of thermally resistant plastic so that a subsequent soldering is possible, for example even in a continuous furnace. …<??>The solution according to the invention is particularly suitable for power semiconductor modules having so-called external control terminals (4) since mounting involving two soldering steps is envisaged, with good accessibility still being provided for wire bonding tools after the first soldering and with the terminal lugs (12) and the necessary components (29, 32) for control terminals (4) only being mounted in the second step. …<IMAGE>… |