| 摘要 |
A process for producing printed boards for electrical circuits in the case of which copper-coated board material is printed with an etch resist or etch resistant lacquer is representative of printed wiring to be produced, and after the curing of the etch resist, the copper layer is etched away at positions where it is not resist-covered. The etch resist is electrically conducting. In a further development of the invention non-conducting etch resist is used for making crossovers of the printed wiring of a multi-layer printed board. |
