发明名称 WIRE BONDING DEVICE
摘要 <p>PURPOSE:To maintain the pressing force to the surface of a heater block of a lead frame constantly by contacting the lead frame for a semiconductor IC placed on the surface of the heater block formed of ferromagnetic material by using a magnet. CONSTITUTION:After a fed lead frame 7 is positioned, a lead frame is intimately contacted with the surface of a heater block 11 by moving a permanent magnet or an electromagnet 12 provided under the heater block 11 to the top thereof. Thus, the depressing part of the lead frame can be eliminated, the lead frame can be simply positioned, the degree of freedom can be increased by the operation of a capillary 6, the maintenance and work can be facilitated, the residual magnetism retained at the heater block causes light friction at the time of feeding the lead frame, and accordingly the positioning can be accurately conducted.</p>
申请公布号 JPS56130933(A) 申请公布日期 1981.10.14
申请号 JP19800034445 申请日期 1980.03.18
申请人 NIPPON ELECTRIC CO 发明人 FUKUI YOSHIAKI
分类号 H01L21/60;H01L21/00 主分类号 H01L21/60
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