| 摘要 |
PURPOSE:To provide the titled compsn. which has excellent glass transition point, moisture resistance and electrical characteristics and is suitable for use in resin- sealing of electrical parts and electronic parts, consisting of an epoxy resin, a hardener, a specified organosilicon polymer, a filler and a curing catalyst. CONSTITUTION:1-50pts.wt. organosilicon polymer (B) of the formula (wherein Rs are the same or different groups and each is monovalent hydrocarbon group, monovalent halogenated hydrocarbon group; Z is a bivalent org. group; n is an average of 10 or more; a, b are each 0 or 1 with the proviso that a+b=1-2), 50-600pts.wt. filler (C) (e.g., silica or a glass fiber) and a curing catalyst (D) (e.g, imidazole or triethylamine), are blended with 100pts.wt. compsn. (A) consisting of 100pts.wt. epoxy resin and 1-200pts.wt. hardener (e.g., diethylenetriamine or a phenolic novolak). |
