| 摘要 |
<p>PURPOSE:To simply seal a composite semiconductor device and to reduce the cost of sealing the device by nipping the sealed unit of a plurality of glass sealed diodes, superposing the container body with a cover of the container and sealing them. CONSTITUTION:A bridge circuit is composed of four double heat sink diodes, and the ends of the leads divided into the input and output sides of the bridge circuit are supported with a tape. The glass tube and the lead connecting parts of the bridge circuit are sealed with a container 10. The container 10 has a container body 12 including a containing part 11 for filling the glass tube and the lead connecting parts at the upper center, and a cover 13 superposed on the body 12 for covering the glass tube or the like. Grooves for filling the leads are formed at both side edges of the body 12. Since the body 12 and the cover 18 can be sealed merely by nipping the glass tube and superposing them with such a configuration, the workability can be improved, and the automation can be adapted. Since the container is inexpensive, the sealing cost can also be reduced.</p> |
