| 摘要 |
Circuit connection for electrical circuitry, and particularly superconducting circuits including Josephson tunnelling devices, wherein solder lands can be used to make electrical connection to electric lines without interdiffusion between the lines and the solder. …<??>To avoid the interdiffusion problem, a laterally extending metallic layer (18) is used as a diffusion barrier between the solder land (28) and the electrical line (M) which can be a superconducting line. The diffusion layer is comprised of refractory metal and has a first portion electrically contacting the solder land and a second, laterally displaced portion, electrically contacting the electrical line. An insulating layer (22) on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the diffusion barrier is comprised of niobium, and the solder is a low melting point alloy, typically comprised of indium, bismuth, and tin. |
