| 摘要 |
PURPOSE:To obtain the surface wave element with high reliability, by coating the adhesives in which particles having the same degree of diameter as the thickness of deisred adhesive bonding layer are mixed on the element mounding area of the stem so that the difference of expansion coefficient between the metallic stem and the elastic surface wave element can be absorbed. CONSTITUTION:A reed screen electrode 7 is formed on a piezoelectric substrate 6 using LiNbO3 with the same method as IC production technology, and the elastic surface wave element formed with the reed screen electrode 7 on the substrate 6 is bonded on the stem 1. In this bonding, spherical particles 5 made of glass having the same degree of particles as the thickness of adhesive layer are mixed in the adhesives 4. The adhesives 4 mixed with the particles 5 is coated to the element mounting area of the stem 1, and after the substrate 6 is placed on the adhesives 4, particles 5 are arranged in a row through the exertion of a prescribed pressure for the baking for a prescribed time to form the adhesive layer with a prescribed thickness. With this method, the difference of the expansion coefficient between the substrate 6 and the stem 1 is absorbed with the adhesives 4 to increase the reliability of the elastic surface wave element. |
