| 摘要 |
A compound comprising molybdenum disulfide emulsified in a resin of the para phenyl phenol formaldehyde group, diluted in a vehicle of the methylbenzene group in a homogenized emulsion is deposited onto metal surfaces preheated to a surface temperature of 350 DEG to 500 DEG F. The heat stored in the metal promotes quick evaporation of the benzene vehicle while the resin sets. The cure and evaporation of the carrier may be further promoted by baking the coated article in an oven at a temperature of 300 DEG to 500 DEG F.
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