| 摘要 |
PURPOSE:To save labor and improve productivity by taking out a wafer housed in a heat-resistant boat with the help of a vacuum pincette whose action is controlled by a control device, from the inclination direction of the wafer and automatically replacing the wafer. CONSTITUTION:A wafer 4 housed in a heat-resistant boat 2 is sucked up by a vacuum pincette (not illustrated) whose action is controlled by a microcomputer, etc. from the inclination direction of the wafer. Next, the pincette 9 is shifted upward to pull out the wafer 4 from a wafer insertion groove 3. Then the pincette 9 is moved toward a receptacle 13, so that the wafer 4 is held by the receptacle 13. Following this procedure, the wafer 4, positioned horizontally, is inserted into a wafer cassette. Next, the replacement of the wafer 4 to the heat-resistant boat from the cassette is carried out almost in an opposite way to the afore-mentioned manner. Thus the wafer 4 is inserted into a wafer insertion groove 3 of the heat-resistant boat. |
