发明名称 VAPOR DEPOSITING APPARATUS APPLYING HOLLOW CATHODE DISCHARGE
摘要 PURPOSE:To easily vapor deposit a high m.p. metal by using the metal in the form of a hollow cathode in a vapor depositing apparatus applying hollow cathode discharge. CONSTITUTION:Hollow cathode 11 is composed of two plates 11a, 11b having the same form and made of metal for vapor deposition, and it is set in discharge chamber 4 of cylindrical body 1 made of stainless steel. Anode 21 and substances 12a, 12b to be treated are arranged over and both sides of cathode 11, respectively. A gas is introduced into chamber 4, and glow discharge is generated between cathode 11 and each substance 12a, 12b with power source 17 to clean the surface of each substance 12a, 12b opposed to cathode 11. The power supply from source 17 is then cut, and arc discharge is generated between cathode 11 and anode 21 with other power source 26 to heat cathode 11 to a high temp. Part of cathode 11 is evaporated and vapor deposited on the cleaned surfaces of substances 12a, 12b. Thus, a high mip. metal such as W or Mo can be vapor deposited easily.
申请公布号 JPS56119771(A) 申请公布日期 1981.09.19
申请号 JP19800024422 申请日期 1980.02.28
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 SUKENOBU SATORU;SUZUKI SETSUO;KADOMA SHIGEKI
分类号 C23C14/24;C23C14/32 主分类号 C23C14/24
代理机构 代理人
主权项
地址