发明名称 MANUFACTURE OF INDUCTANCE FOR THICK FILM INTEGRATED CIRCUIT
摘要 <p>PURPOSE:To obtain an inductance coil by screen printing as well as reduce its cost by forming a coil-shaped conductor wiring on a substrate of ceramic or the like, using an insulator as a core. CONSTITUTION:On an insulative substrate 1 of ceramic or the like, the lower conductor 2 is printed by screen printing and sintered. Then, an insulator 3 and the upper conductor 4 are printed and sintered. Thus, the conductor wiring is formed into a coil shape in order to obtain inductance characteristics. Moreover, the lower conductor 2 and the upper conductor 4 are interconnected by piling the patterns one upon another outside the insulator 3. Thereby, allowance is provided for circuit design, and the production costs can be reduced.</p>
申请公布号 JPS56118307(A) 申请公布日期 1981.09.17
申请号 JP19800020609 申请日期 1980.02.22
申请人 HITACHI ELECTRONICS 发明人 HIRAMA TOSHIAKI
分类号 H05K1/16;H01F5/00;H01F27/28 主分类号 H05K1/16
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