| 摘要 |
PURPOSE:To obtain economically a tape carrier of higher reliability and actual usability, by forming independently more than two kinds of pattern of the conductive layer lead wire and connecting independently more than two kinds of semiconductors thereto. CONSTITUTION:On the surface of the substrate 41 semiconductors A, B... are formed in a matrix manner on the positions 42, 43... so that they are equipped with conductive layers for outside pull-out. On the other hand, a metal layer is formed on a tape carrier 40, which is photoetched to form desired lead wire pattern, and the lead wire patterns 42', 43'... are formed in the matrix order. When semiconductor is connected corresponding to each lead wire pattern, more than two kinds of lead wire pattern are formed independently each other, and a device with tape carrier can be obtained in which more than two kinds of devices are independently connected corresponding to each lead wire pattern. It is not necessary to align reels according to the grades. When the semiconductor device is formed by means of master slice method, the said formation is particularly effective. |
