发明名称 DETECTING METHOD FOR DISPLACEMENT IN TESTING STAGE OF WAFER
摘要 PURPOSE:To detect a position displacement accurately by a method wherein the contact of a probe for detection with displacement detecting pads is started when a contacting area between the pad and the probe becomes smaller than an area of a tip of a probe, and the existence of continuity with the probe keeping contact with a return pad during contact is utilized. CONSTITUTION:When a displacement occurs in indexing action and a contacting area between a probe 9 and a connecting pad of a semiconductor chip 2 reaches about half of an area of a tip section, the contact of a tip of a probe 10 for detection with either of pads 51-54 for detecting the displacement is started, and the tip of the probe 10 is conducted with a pad 6 for return through the corresponding electric circuits of electric circuits 71-74. Thus, the indexing direction in which the displacement is generated can easily by detected by means of a comparator circuit.
申请公布号 JPS56114349(A) 申请公布日期 1981.09.08
申请号 JP19800017666 申请日期 1980.02.15
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 HONDA TETSUO
分类号 H01L21/66;G01R31/316 主分类号 H01L21/66
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