Splitting device for semiconductor substrate plates - used for hybrid circuit mfr. using suction field with edges along substrate dividing lines

摘要

The device comprises a suction chamber (10) with a guide surface across which a semiconductor substrate, divided into various zones (14,15,16) by transverse and longitudinal dividing lines (17), is fed. The guide surface incorporates a suction field with hard rubber side edges (21) and a matrix of soft rubber edges (22) corresponding to the configuration of the substrate dividing lines. A suction opening (20) is positioned in each of the zones defined by the matrix. The suction field is a removable insert, allowing the device to be readily modified in accordance with the way the substrate is to be split. The device is used for mass prodn. of thick film hybrid circuits, a number of which are formed on a large substrate before being divided into individual substrate plates.