| 摘要 |
Compositions containing siloxane-modified epoxy resins, epoxy, methacryl, or amino organofunctional alkoxysilicon compound and conventional epoxy curing agents are described which have improved resistance to degradation of both electrical properties and adhesion when exposed to moisture or boiling water. The compositions consist essentially of (A) siloxane-modified epoxy resin, (B) an organofunctional alkoxysilicon compound such as gamma -aminopropyltrimethoxysilane, gamma -methacryloxypropyltrimethoxysilane, or gamma -glycidoxypropyltrimethoxysilane, and (C) curing agents such as carboxylic acid anhydrides.
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