| 摘要 |
<p>PURPOSE:To separate a semiconductor element from a sheet without using a special solvent after etching by weakening tackiness of an adhesive applied on the sheet when the semicondutor element is subjected to etching. CONSTITUTION:After a wafer 4 having a P-N junction 1 and electrodes 2, 3 is fixed on a sheet 6 with an adhesive 5 applied on one face, a scribed groove 7 is provided for easy cut and separation. Next, it is pressurized by a proper method to separate into each element 41. Then, the sheet 6 is pulled to separate the elements 41 each other. From putting them in an etching reagent as separated each other, chips and burrs 8 are dissolved and removed and a tackiness of the adhesive is weakened, therefore they can be easily taken off with a collet. Since there needs no special solvent after etching according to the above constitution, the operation is facilitated to adapt for automation.</p> |
