| 摘要 |
PURPOSE:To equalize the thickness of the sealing resin and the flowout of the resin by surrounding the part corresponding to the sealing region of the semiconductor element with a frame and filling the resin therein. CONSTITUTION:The semiconductor element 6 such as an LSI or the like is placed on an insulating substrate 4, and the internal terminal 52 is connected to the external terminal 5 via a gold wire 5. The frame 7 of predetermined size is set as indicated by a broken line within the region designated by two one-dotted broken lines. The circuit body and the frame surface are fitted with normal temperature curable epoxy resin adhesive. Subsequently, the sealing resin is filled in the frame 7. Thus, the sealed part is not raised highly due to the surface tension of the sealing resin, but uniformly formed in a thin thickness. The molten sealing resin is flowed out to the external terminal due to the presence of the frame to prevent the occurrence of improper solder of the external terminal. |
