发明名称 MOLDING METHOD FOR THINNPLATEEFORM MEMBER
摘要 <p>PURPOSE:To facilitate release of the thin-plate-form member from a metal mold by a method wherein resin films whose melting point is higher than the molding temperature of a compounded material are set on the material which is a preimpregnated material or thin-plate-form member formed of fibers and resin and are pressed and heated by the metal mold. CONSTITUTION:A sheet 3 of the compounded material of carbon fibers and resin in the half-set state and the resin films 4 and 5 positioned above and below the sheet material 3 are set between a punch 1 and a die 2. The numeral 6 indicates the guide of the punch which positions the punch and the die 2. After the metal mold is set and pressure is applied by a hot press, heating is performed for a required time in that state. Under the condition, the sheet material 3 and the resin films 4 and 5 are connected by heat to each other and the sheet material 3 is set, and thus a molded article is obtained by applying outside-diameter processing (pressing). As the compounded material, the preimpregnated material can also be used in place of the sheet material. In addition, setting of the resin film only on one side of the above or below of the sheet material 3 may also be applicable.</p>
申请公布号 JPS56104026(A) 申请公布日期 1981.08.19
申请号 JP19800007270 申请日期 1980.01.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAGAWA KOUICHIROU;WAKABAYASHI KON
分类号 B29C70/06;B29C43/02;B29C43/18;B29C43/20;B29C57/00;B32B37/00 主分类号 B29C70/06
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