| 摘要 |
An improved process for providing a design within a metallic surface by composite photoresist techniques in which the composite photoresist has sufficient chemical resistance to permit etching the design, with an aqua-regia or aqua-regia fluoride system in the most commercially available corrosion resistant and high temperature resistant alloys and metals. The process consists in applying a first coating of epoxy resin or other resin to the metal substrate or surface to be etched; subsequently applying a conventional photoresist material upon the cured resin; applying a photomask to said photoresist in a desired pattern; exposing the photomask to a light source to actuate the photoresist; chemically removing the photoresist in the non-activated areas; subsequently removing the epoxy or other resin underlying the non-activated areas preferably by means of a concentrated solution of sulfuric acid, which dissolves the resin but does not attack the photoresist and thereby exposing the metallic substrate in the same pattern as that developed upon the photoresist, and subsequently etching the metal by means of a mixture of acids capable of reacting with the metallic surface under the reaction conditions chosen, but not with the resin layer.
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