| 摘要 |
PURPOSE:To improve the adhesiveness of the lead and circuit and to make easier the visual inspection on the wettability of the solder flux, by putting the end of the lead vertically on to the surface of the substrate, making slanted cut on both sides of the end of the lead and applying solder flux to the end and the slanted portions of the lead. CONSTITUTION:The outer lead 13 which extend, by the inner lead 12, from the four sides of the package 11 constituting the resin mold that contains semiconductor pellet, lead and wire are bent vertically downward immediately they extend from the package 11. The end 14 of the lead 13 is put on to the solder printed circuit 16 formed on the surface of the substrate 15, and the end 14 and the circuit 16 are connected. The both sides of the end 14 of the lead are sharpened out in a manner that it takes the shape of the central flat portion 17 and the slanted portion 18 on both sides. The slanted portions are covered with soldering flux to make sure the adhesion between the lead and the circuit. |
