发明名称 MANUFACTURE OF HEATTINSULATING PANEL BOARD
摘要 <p>PURPOSE:To obtain the heat-insulating panel board by opening and expanding outward the bent piece of the 2nd long metal plate provided with a seal layer on the inside surface thereof, by putting the 1st long metal plate in the piece expanded so as to seal surely two plates, and then by filling the space between the metal panels with foamed resin. CONSTITUTION:While the 1st long metal plate 1 is conveyed in such a manner that it is kept straight at a prescribed position, the 2nd long metal plate 2 having the bent pieces 2a at both end parts in the direction of the width thereof and provided with seal layers A on the inside surfaces of the pieces is conveyed in the state that the bent pieces 2a are kept opened and expanded outward up to the vicinity of the prescribed position and is fitted with pressure to both end surfaces 1a in the direction of the width of the 1st long metal plate 1, whereby a hollow frame body B is formed consecutively. Next, a frame body is formed by injecting foamed resin from the prescribed position into the hollow body B. After that, the frame body is cut in desired length.</p>
申请公布号 JPS5693526(A) 申请公布日期 1981.07.29
申请号 JP19790170367 申请日期 1979.12.28
申请人 YOSHIDA KOGYO KK 发明人 HORI YOSHIAKI
分类号 B32B5/18;B29B7/00;B29C39/00;B29C39/10;B29C39/16;B29C39/18;B29C39/22;B32B43/00 主分类号 B32B5/18
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