发明名称 A semiconductor device and a method of manufacturing a semiconductor device.
摘要 <p>An insulator layer 2 is provided over the surface of a P type semiconductor substrate. A P type semiconductor region is provided below the insulator layer and functions as one electrode of a capacitor of the device. A relatively heavily doped N-type region 5 is provided below the P-type region 4. A conductive layer 9 is provided over the insulating layer over the heavily doped P-type region 4, and functions as another electrode of the capacitor of the device and extends into a field region to provide a field shield layer. &lt;??&gt;The capacitor may be a capacitor of a 1-transistor, 1-capacitor memory cell, in which case the heavily doped P-type region 5 and the conductive layer 9 do not extend to a gate region of a transfer gate transistor of the memory cell. </p>
申请公布号 EP0032030(A2) 申请公布日期 1981.07.15
申请号 EP19800304617 申请日期 1980.12.19
申请人 FUJITSU LIMITED 发明人 NAKANO, MOTOO
分类号 H01L27/10;G11C11/404;H01L21/8242;H01L27/108;H01L29/78;(IPC1-7):01L27/10;11C11/24;01L29/94 主分类号 H01L27/10
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