| 摘要 |
PURPOSE:To prevent exfoliation and improve a moistureproof property by a method wherein an IC pellet is connected onto a projection section of a metallic substrate, grooves are formed near the root of the projection and indentations at both sides of the grooves, and resin is additionally transferred to the indentations when sealed with resin. CONSTITUTION:A resin sealing power IC semiconductor device is prepared in such a manner that an IC pellet 2 is connected onto a metallic substrate 1, an electrode of the pellet is connected to leads 4 by metallic small wires, and the pellet is covered with a resin section 5. The IC pellet of such a device is joined onto a projection section 1a of the substrate 1, grooves 7 are formed near the root of the projection section 1a, and indentations 9 are made up at both sides of the grooves 7. Thus, resin is additionally transferred to the indentations 9 when sealed with resin, interface compression stress in case of cooling is absorbed to prevent exfoliation between the substrate and the resin, and the infiltration of moisture is prevented to improve a moistureproof property. |
