DEVELOPING DEVICE OF SEMICONDUCTOR WAFER

摘要

PURPOSE:To completely remove the developing solution run out to the rear surface of the subject wafer by a method wherein a developing nozzle and a rinse nozzle are provided on the upper part of a developing chamber and a nozzle is provided for injection of the rinsing solution upward. CONSTITUTION:The wafer 9 is fixed on a vacuum chuck 2 connected to a motor 4 and arranged in a developing chamber 1, the developing nozzle 5 and the rinse nozzle 6 are provided above the chamber 1 and the rinse nozzle 7 is provided at the lower part of the chamber. Then the rinsing solution is injected from the rinse nozzle 7. As a result, the developing solution spread out to the reverse surface of the wafer can be removed completely.