| 摘要 |
PURPOSE:To ensure a quick and high-accuracy formation of a through-hole for a thin-film magnetic head, by forming a conductor coil layer after providing a lift- off layer for formation of through-hole on the substrate. CONSTITUTION:The insulated layer 2 is formed on the substrate 1 by the SiO2, and then a conductor layer is formed by the Al-Cu or the like. This Al-Cu conductor layer is etched to form the terminal pattern 3. Then the lift-off layer 4 of Cr or the like having the selective etching properties is formed, and then the SiO2 insulated layer 5 is formed as the protective film of the pattern 3. After this, the lower magnetic layer 6 is formed by the mask vapor deposition method, and then the insulated layer 7 of SiO2 and then the adhesion layer 8 of Al2O3 or the like are formed. Finally the lift-off layer 4 is removed to obtain the through-hole 9 of a desired size. |
