Coating surface to be metallised with adhesive layer - contg. (semi)active filler, phenol! novolak, aminoplast and polyglycol

摘要

Flexible, absorbent adhesive agent layer on a carrier to be metallised contains finely-divided active and semi-active inorganic filler, phenol, novolak resin, aminoplast and polyglycol, in addn. to nitrile rubber and polyglycol. The surface to be metallised can be further provided with embedded corundum grains. The surface as well as total layer thickness can be provided with active positions for metallising. In printed circuit mfr. the adhesive agent-coated epoxide/glass and phenoplast/paper substrates can be chemically Cu-plated to 2 mu-thickness and then Cu electroplated to form Cu layers having thickness 35 micron and adhesive strength over 40 (50-70)N/in., i.e. similar to that achieved with chemically pickled control surfaces.