| 摘要 |
<p>Apparatus for applying a lubricating material to an electrically conductive substrate comprising: first means to divide a supply of lubricating material into a spray of particles, to remove from said spray the larger particles whose weight to diameter ratio is such that they will not remain suspended in substantially quiescent atmosphere, and to deliver the remaining finely divided particles for application on at least one side of the substrate; second means including a housing having at least one opening, to encompass the substrate and to provide a chamber on said at least one side in communication with said first means, and to maintain a substantially quiescent atmosphere of finely divided particles within the chamber; electrode means within the chamber of the second means, spaced from said at least one side of the substrate, and adapted to inhibit the collection of lubricant thereof; transport means for moving the substrate into and out of said chamber along a path, and voltage means to apply voltage to said electrode means of sufficient magnitude to create a charging field to charge and deposit the finely divided particles of lubricating material on said substrate from the substantially quiescent atmosphere within the chamber. The apparatus uniformly dispurses lubricating particles substantially only by electrostatic forces onto the surface of the longitudinally moving substrate. The percentage coverage of the tiny lubricating spheres on the conducting substrate surface is dependent only upon the quantity of such particles migrating into the partitioned enclosure and the relative velocity (and hence dwell time within the enclosure) of the conducting substrate. The coverage is substantially uniform because of substantially uniform charge/mass ratios provided; because of the controlled uniform supply of the particles across a transverse dimension of the substrate and because the longitudinally partitioned non-conducting enclosure prevents non-random movement of the tiny spheres as they enter the partitioned enclosure and prevents any tendency to deposit the charged particles on the enclosure surfaces rather than on the substrate, per se.</p> |
