发明名称 OXIDE FILM COATING OF COMPOUND SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a quality insulating film with a small surface level density through a process consisting of, when an oxide film is formed on a GaAs substrare, prebiously, providing an additional layer of thin metallic-As film or a low-class As oxide layer and feeding an As component to the substrate in substrate heat-oxidation process. CONSTITUTION:A thin metallic-As film 2 is vacuum-deposited or As is deposited in the low vacuum whose O2 pressure is set to 10<-4>-10<-3> Torr on the surface of a GaAs substrate 1. A thin low-class oxide film 2 is deposited thereon. Next, thus- obtained work is heat-treated in O2 gas or the mixture gas of O2 and N2 through two-step reaction. Namely, in the first step, the film 2 is oxidized to generate a quality As2O3 layer at the atmospheric temperatures of 230-350 deg.C and, in the second step, the base material of the substrate 1 is oxidized using the As2O3 film as protective film. Thereby, the Ga2O3 layer generated on the base material by the As2O3 layer generated at the surface of the substrate 1 is prevented to transfer for obtaining an insulating film with an As2O3/Ga2O3 ratio of 1.
申请公布号 JPS5671942(A) 申请公布日期 1981.06.15
申请号 JP19790147629 申请日期 1979.11.16
申请人 OKI ELECTRIC IND CO LTD;ONO INSEI 发明人 ISHII YASUHIRO;SHIMANO NORIYUKI;ONO INSEI
分类号 H01L29/78;H01L21/316 主分类号 H01L29/78
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